KAMIYA Shoji

写真a

Affiliation Department

Department of Electrical and Mechanical Engineering
Department of Electrical and Mechanical Engineering

Title

Professor

External Link

Degree

  • 工学修士 ( - )

  • 工学博士 ( - )

Research Areas

  • Manufacturing Technology (Mechanical Engineering, Electrical and Electronic Engineering, Chemical Engineering) / Mechanics of materials and materials

From School

  • Tohoku University   Faculty of Engineering

    - 1984.03

      More details

    Country:Japan

From Graduate School

  • Tohoku University   Graduate School, Division of Engineering   Doctor's Course

    - 1989.03

      More details

    Country:Japan

External Career

  • 東北大学工学研究科   准教授

    1998.04

      More details

    Country:Japan

  • 東北大学工学研究科   講師

    1997.04 - 1998.03

      More details

    Country:Japan

  • 東北大学工学部   講師

    1991.04 - 1997.03

      More details

    Country:Japan

  • 東北大学工学部   助手

    1988.04 - 1991.03

      More details

    Country:Japan

Professional Memberships

  • 日本機械学会

 

Research Career

  • Strength evaluation of thin films on the basis of fracture mechanics

    (not selected)  

    Project Year:

  • Study on the Fracture Process of Fiber-Reinforced Composite Materials

    (not selected)  

    Project Year:

Papers

  • A multidimensional scheme of characterization for performance deterioration behavior of flexible devices under bending deformation Reviewed

    Shoji Kamiya, Hayato Izumi, Tomohito Sekine, Nobuyuki Shishido, Hiroko Sugiyama, Yasuko Haga, Takeo Minari, Masaaki Koganemaru, Shizuo Tokito

    Thin Solid Films   2019

     More details

    Authorship:Lead author   Language:English   Publishing type:Research paper (scientific journal)  

  • High-Strength Sub-Micrometer Spherical Particles Fabricated by Pulsed Laser Melting in Liquid Reviewed

    Mitsuhiko Kondo, NobuyukiShishido, Shoji Kamiya, Atsushi Kubo, Yoshitaka Umeno, Yoshie Ishikawa, Naoto Koshizaki

    Particle and Particle Systems Characterization   35 ( 7 )   1800061   2018.07

     More details

    Language:English   Publishing type:Research paper (scientific journal)  

  • Electronic imaging of subcritical defect accumulation in single crystal silicon under fatigue loading Reviewed

    Shoji Kamiya, Akira Kongo, Hiroko Sugiyama, Hayato Izumi

    Sensors and Actuators A: Physical   279   705 - 711   2018

     More details

    Language:English   Publishing type:Research paper (scientific journal)  

  • World-first electronic imaging of subcritical slip glowth in single crystal silicon under fatigue lopading

    Shoji Kamiya, Akira Kongo, Hiroko Sugiyama, Hayato Izumi

    The 19th international conference on solid-state sensors, actuators, and microsystems   1229 - 1232   2017.06

     More details

    Language:English   Publishing type:Research paper (international conference proceedings)  

  • Shear stress enhanced fatigue damage accumulation in single crystalline silicon under cyclic mechanical loading Reviewed International journal

    Shoji Kamiya, Arasu Udhayakumar, Hayato Izumi, Kozo Koiwa

    Sensors and Actuators A: Physical   2016.04

     More details

    Authorship:Lead author   Language:English   Publishing type:Research paper (scientific journal)  

  • Investigation of continuous deformation behavior around initial yeild point of single crystal copper by using micro scale torsion test Reviewed International journal

    Koiwa Kozo, Nobuyuki Shishido, Chuantong Chen, Masaki Omiya, Shoji Kamiya, Hisashi Sato, Masahiro Nishida, Tkashi Suzuki, Tomoji Nakamura, Toshiaki Suzuki, Takeshi Nokuo

    Scripta Materialia   111   94 - 97   2016.01

     More details

    Authorship:Lead author   Language:English   Publishing type:Research paper (scientific journal)   Publisher:Elsevier  

  • Shear stress with hydrogen, not oxygen, matters to the fatigue lifetime of silicon International journal

    S. Kamiya, A. Udhayakumar, H. Izumi, K. Koiwa

    Proceedings of Transducers 2015, Anchorage, Alaska   2015.06

     More details

    Authorship:Lead author   Language:English   Publishing type:Research paper (international conference proceedings)  

  • Evaluation of adhesion energy and its correlation to apparent strength for Cu/SiN interface in copper damascene interconnect structures International journal

    S. Kamiya, C. Chen, N. Shishido, M. Omiya, K. Koiwa, H. Sato, M. Nishida, T. Suzuki, T. Nakamura, T. Nokuo, T. Suzuki

    Proceedings of IEEE 2015 International Interconnect Tehcnology Conference/Materials for Advanced Metallization Conference   2015.05

     More details

    Authorship:Lead author   Language:English   Publishing type:Research paper (international conference proceedings)  

  • Scenario for catastrophic failure in interconnect structures under chip packaging interaction Reviewed International journal

    Masaki Omiya, Shoji Kamiya, Nobuyuki Shishido, Kozo Koiwa, Hisashi Sato, Masahiro Nishida

    Proceedings of IEEE International Reliability Physics Symposium   5C.3.1 - 5C.3.5   2015.04

     More details

    Language:English   Publishing type:Research paper (international conference proceedings)  

  • Hydrogen enhanced on mechanical fatigue in single crystal silicon Reviewed

    142   130 - 132   2014.11

     More details

    Language:English   Publishing type:Research paper (scientific journal)  

display all >>

Presentations

  • き裂進展シミュレーションによるLSIのCu/SiN界面付着強度に対する銅の結晶粒構造の影響の評価

    なむすらいまんだふぞる、小岩康三、大宮正毅、宍戸信之、神谷庄司、佐藤尚、西田政弘、鈴木貴志、中村友二、鈴木俊明、野久尾毅

    日本機械学会東海支部第62期総会講演会 

     More details

    Event date: 2013.03

    Language:Japanese   Presentation type:Oral presentation (general)  

  • 電子線誘起電流を用いた圧縮応力下におけるシリコンの疲労損傷の観察

    喜多俊文、神谷庄司、泉隼人、梅原のりつぐ、ところやま貴行、小川将史

    日本機械学会東海支部第62期総会講演会 

     More details

    Event date: 2013.03

    Language:Japanese   Presentation type:Oral presentation (general)  

  • 半導体デバイス配線中のCu/SiN界面局所付着強度に及ぼす銅の結晶方位の影響

    大浦由香、杉山祐子、宍戸信之、神谷庄司、佐藤尚、小岩康三、西田政弘、大宮正毅、鈴木貴志、中村友二、鈴木俊明、野久尾毅

    日本機械学会東海支部第62期総会講演会 

     More details

    Event date: 2013.03

    Language:Japanese   Presentation type:Oral presentation (general)  

  • 配線銅/保護層界面剥離試験中の銅結晶粒構造その場観察による界面付着強度と局所変形との相関評価 International conference

    松瀬優や、宍戸信之、神谷庄司、佐藤尚、杉山祐子、小岩康三、西田政弘、大宮正毅、鈴木貴志、中村友二、鈴木俊明、野久尾毅

    日本機械学会東海支部第62期総会講演会 

     More details

    Event date: 2013.03

    Language:Japanese   Presentation type:Oral presentation (general)  

  • 単結晶シリコンの塑性特性における吸蔵水素の影響 International conference

    向山諒汰、泉隼人、宍戸信之、神谷庄司

    日本機械学会東海支部第62期総会講演会 

     More details

    Event date: 2013.03

    Language:Japanese   Presentation type:Oral presentation (general)  

  • Crystal orientation effect on local adhesion strength of the interface between a damascene copper line and the insulation layer International conference

    Nobuyuki Shishido, Yuka Oura, Hisashi Sato, Shoji Kamiya, Kozo Koiwa, Masaki Omiya, Masahiro Nishida, Takashi Suzuki, Tomoji Nakamura, Takeshi Nokuo, Toshiaki Suzuki

    Materials for Advanced Metallization 

     More details

    Event date: 2013.03

    Language:English   Presentation type:Oral presentation (general)  

  • Evaluation for interface strength fluctuations induced by inhomogeneous grain structure of Cu line in LSI Interconnects International conference

    Chuantong Chen, Nobuyuki Shishido, Shoji Kamiya, Kozo Koiwa, Hisashi Sato, Masaki Omiya, Masahiro Nishida, Takashi Suzuki, Tomoji Nakamura, Takeshi Nokuo, Toshiaki Suzuki

    Materials for Advanced Metallization 2013 

     More details

    Event date: 2013.03

    Language:English   Presentation type:Oral presentation (general)  

  • Development of interfacial crack extension simulation between coper and insulation layer with multi-grain structure International conference

    Kozo Koiwa, Masaki Omiya, Nobuyuki Shishido, Shoji Kamiya, Hisashi Sato, Masahiro Nishida, Takashi Suzuki, Tomoji Nakamura, Toshiaki Suzuki, Takeshi Nokuo

    Mateirals for Advanced Metallization 2013 

     More details

    Event date: 2013.03

    Language:English   Presentation type:Oral presentation (general)  

  • サブミクロンスケールの局所強度評価 International conference

    大宮正毅

    テクニカルショウヨコハマ2013 

     More details

    Event date: 2013.02

    Language:Japanese   Presentation type:Poster presentation  

  • LSI配線構造中のCu/絶縁膜界面の結晶粒レベル局所強度に対応するサブミクロン機械工学への挑戦

    神谷庄司、佐藤尚、大宮正毅、宍戸信之、小岩康三、西田政弘、中村友二、鈴木貴志、野久尾毅、鈴木俊明

    第155回研究集会「配線・実装技術と関連材料技術」 

     More details

    Event date: 2013.02

    Language:Japanese   Presentation type:Oral presentation (invited, special)  

display all >>

Awards

  • 日本機械学会機械材料・材料加工部門一般表彰(奨励講演論文部門)

    2013.01   日本機械学会  

    陳傳彤、宍戸信之、小岩康三、神谷庄司、大宮正毅、佐藤尚、西田政弘、鈴木貴志、中村友二、鈴木俊明、野久尾毅

     More details

    Award type:Award from Japanese society, conference, symposium, etc.  Country:Japan

  • Presentation award of MAM 2012 (Materials for Advanced Metallization, Grenoble)

    2012.03   Organizing committee of MAM 2012  

    Nobuyuki Shishido, et al.

     More details

    Award type:Award from international society, conference, symposium, etc.  Country:France

 

Committee Memberships

  • 日本機械学会   InterPACK 2013 Track Chair  

    2012.09 - 2013.07   

      More details

    Committee type:Academic society