Presentations -

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  • A transmit diversity scheme with pre-emphasis suitable for impulse-radio implant communication International conference

    L. Liu, J. Wang

    29th International Symposium on Antennas and Propagation (ISAP 2024)  2024.11  ISAP

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    Event date: 2024.11

    Language:English   Presentation type:Oral presentation (general)  

    Venue:Incheon   Country:Korea, Republic of  

  • T1-UTPケーブルのコモンモード特性の配策依存性軽減のための基礎検討

    木村 肇、矢野佑典、和田修己、王 建青

    電子情報通信学会技術研究報告  2024.07  電子情報通信学会

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    Event date: 2024.07

    Language:Japanese   Presentation type:Oral presentation (general)  

    Venue:東京   Country:Japan  

  • Suppression Effect of Ringing in Contact Discharge Waveform From Two Different ESD Generators via Ferrite Core Attached Return Current Cable International conference

    Y. Tozawa, T. Ishida, J. Wang, and O. Fujiwara

    APEMC 2024, Okinawa, Japan  2024.05  IEICE & IEEE

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    Event date: 2024.05

    Language:English   Presentation type:Oral presentation (general)  

    Venue:Okinawa   Country:Japan  

  • Generalized MMSE-Based Pre-Emphasis for High-Speed Implant Communication International conference

    K. Miyazaki, L. Liu, and J. Wang

    APEMC 2024, Okinawa, Japan  2024.05  IEICE & IEEE

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    Event date: 2024.05

    Language:English   Presentation type:Oral presentation (general)  

    Venue:Okinawa   Country:Japan  

  • A Study on Reducing Cable Length Dependence for Automotive Ethernet EMC Evaluation International conference

    H. Iwasaki, Y. Yano, and J. Wang

    APEMC 2024, Okinawa, Japan  2024.05  IEICE & IEEE

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    Event date: 2024.05

    Language:English   Presentation type:Oral presentation (general)  

    Venue:Okinawa   Country:Japan  

  • Extraction of Parasitic Impedance Difference Between Electronic Device Test Boards International conference

    Y. Iwaoka, Y, Yano, and J. Wang

    APEMC 2024, Okinawa, Japan  2024.05  IEICE & IEEE

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    Event date: 2024.05

    Language:English   Presentation type:Oral presentation (general)  

    Venue:Okinawa   Country:Japan  

  • Circuit Model Construction for Simulating ESD Discharge Current Flowing Through CMCs and ESD Suppression Devices International conference

    H. Ito, S. Ishihara, Y. Yano, and J. Wang

    APEMC 2024, Okinawa, Japan  2024.05  IEICE & IEEE

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    Event date: 2024.05

    Language:English   Presentation type:Oral presentation (general)  

    Venue:Okinawa   Country:Japan  

  • Improvement of Implant Communication Using Joint Spatial Transmit Diversity and Signal Pre-Emphasis International conference

    L. Liu, J. Wang

    APEMC 2024, Okinawa, Japan  2024.05  IEICE & IEEE

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    Event date: 2024.05

    Language:English   Presentation type:Oral presentation (general)  

    Venue:Okinawa   Country:Japan  

  • Measurement Method for Mixed-Mode S-Parameters of Termination Structures in Differential Communication Line International conference

    M. Yoshida, Y. Yano, and J. Wang

    APEMC 2024, Okinawa, Japan  2024.05  IEICE & IEEE

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    Event date: 2024.05

    Language:English   Presentation type:Oral presentation (general)  

    Venue:Okinawa   Country:Japan  

  • Powered ESD試験における車載EthernetトランシーバICへの干渉電圧の回路シミュレーションによる検討

    中谷透也、矢野佑典、王 建青

    電子情報通信学会技術研究報告  2024.03  電子情報通信学会

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    Event date: 2024.03

    Language:Japanese   Presentation type:Oral presentation (general)  

    Venue:松江   Country:Japan  

  • Bandwidth Expansion and Communication Performance Improvement of In-Body HF-UWB Small Antenna by Pre-Emphasis

    K. Miyazaki, L. Liu, and J. Wang

    IEICE EMCJ Technical Meeting  2023.10  IEICE

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    Event date: 2023.10

    Language:Japanese   Presentation type:Oral presentation (general)  

    Venue:Yonezawa   Country:Japan  

  • Study of Battery-less of BLE Module by Piezoelectric Element Mounted on Shoe Sole

    S. Dan, Y. Yano, and J. Wang

    IEICE EMCJ Technical Meeting  2023.10  IEICE

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    Event date: 2023.10

    Language:Japanese   Presentation type:Oral presentation (general)  

    Venue:Yonezawa   Country:Japan  

  • SAR evaluation for bandwidth-enhanced implant communication system with pre-emphasis technique International coauthorship International conference

    L. Liu, H. Takagi, J. Shi and J. Wang

    URSI GASS 2023  2023.08  URSI

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    Event date: 2023.08

    Language:English   Presentation type:Oral presentation (general)  

    Venue:Sapporo   Country:Japan  

  • Improvement of TLP-HMM’s load dependence International conference

    M. Yoshida, Y. Yano, T. Ishida, and J. Wang

    2023 IEEE Int. Symp. on EMC, Signal & Power Integrity  2023.08  IEEE

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    Event date: 2023.07 - 2023.08

    Language:English   Presentation type:Poster presentation  

    Venue:Grand Rapids   Country:United States  

  • Wall shaking amplitude effects on vibrating intrinsic reverberation chamber characteristics International coauthorship International conference

    M. Hara, J. Wang, and F. Leferink

    2023 IEEE Int. Symp. on EMC, Signal & Power Integrity  2023.08  IEEE

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    Event date: 2023.07 - 2023.08

    Language:English   Presentation type:Oral presentation (general)  

    Venue:Grand Rapids   Country:United States  

  • Investigation of reducing test system dependence for automotive Ethernet EMC evaluation International conference

    Y. Yano, H. Iwasaki, and J. Wang

    2023 IEEE Int. Symp. on EMC, Signal & Power Integrity  2023.08  IEEE

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    Event date: 2023.07 - 2023.08

    Language:English   Presentation type:Oral presentation (general)  

    Venue:Grand Rapids   Country:United States  

  • Quantification for setting the electric field Strength to achieve an exposure level of 6 W/kg in a reverberation chamber International conference

    Jianqing Wang

    45th Annual Int. Conf. of IEEE Eng. in Med. & Biol. Society (IEEE EMBC 2023)  2023.07  IEEE

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    Event date: 2023.07

    Language:English   Presentation type:Poster presentation  

    Venue:Sydney   Country:Australia  

  • Performance evaluation of 10-60 MHz implant communication at 20 Mb/s using signal pre-emphasis technique International conference

    L. Liu, H. Takagi, K. Miyazaki, and J. Wang

    45th Annual Int. Conf. of IEEE Eng. in Med. & Biol. Society (IEEE EMBC 2023)  2023.07  IEEE

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    Event date: 2023.07

    Language:English   Presentation type:Poster presentation  

    Venue:Syndey   Country:Australia  

  • Wearable device EMC Invited International conference

    Jianqing Wang

    2023 IEEE Int. Conf. on Electronic Information and Comm. Tech. (ICEICT)  2023.07  IEEE

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    Event date: 2023.07

    Language:English   Presentation type:Oral presentation (keynote)  

    Venue:Qingdao   Country:China  

  • Study of ESD Discharge Current Test Board for ESD Suppression Devices for Automotive Ethernet

    S. Ishihara, Y. Yano, and J. Wang

    IEICE EMCJ Technical Meeting  2023.06  IEICE

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    Event date: 2023.06

    Language:Japanese   Presentation type:Oral presentation (general)  

    Venue:Sapporo   Country:Japan  

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