Presentations -
-
A transmit diversity scheme with pre-emphasis suitable for impulse-radio implant communication International conference
L. Liu, J. Wang
29th International Symposium on Antennas and Propagation (ISAP 2024) 2024.11 ISAP
Event date: 2024.11
Language:English Presentation type:Oral presentation (general)
Venue:Incheon Country:Korea, Republic of
-
T1-UTPケーブルのコモンモード特性の配策依存性軽減のための基礎検討
木村 肇、矢野佑典、和田修己、王 建青
電子情報通信学会技術研究報告 2024.07 電子情報通信学会
Event date: 2024.07
Language:Japanese Presentation type:Oral presentation (general)
Venue:東京 Country:Japan
-
Suppression Effect of Ringing in Contact Discharge Waveform From Two Different ESD Generators via Ferrite Core Attached Return Current Cable International conference
Y. Tozawa, T. Ishida, J. Wang, and O. Fujiwara
APEMC 2024, Okinawa, Japan 2024.05 IEICE & IEEE
Event date: 2024.05
Language:English Presentation type:Oral presentation (general)
Venue:Okinawa Country:Japan
-
Generalized MMSE-Based Pre-Emphasis for High-Speed Implant Communication International conference
K. Miyazaki, L. Liu, and J. Wang
APEMC 2024, Okinawa, Japan 2024.05 IEICE & IEEE
Event date: 2024.05
Language:English Presentation type:Oral presentation (general)
Venue:Okinawa Country:Japan
-
A Study on Reducing Cable Length Dependence for Automotive Ethernet EMC Evaluation International conference
H. Iwasaki, Y. Yano, and J. Wang
APEMC 2024, Okinawa, Japan 2024.05 IEICE & IEEE
Event date: 2024.05
Language:English Presentation type:Oral presentation (general)
Venue:Okinawa Country:Japan
-
Extraction of Parasitic Impedance Difference Between Electronic Device Test Boards International conference
Y. Iwaoka, Y, Yano, and J. Wang
APEMC 2024, Okinawa, Japan 2024.05 IEICE & IEEE
Event date: 2024.05
Language:English Presentation type:Oral presentation (general)
Venue:Okinawa Country:Japan
-
Circuit Model Construction for Simulating ESD Discharge Current Flowing Through CMCs and ESD Suppression Devices International conference
H. Ito, S. Ishihara, Y. Yano, and J. Wang
APEMC 2024, Okinawa, Japan 2024.05 IEICE & IEEE
Event date: 2024.05
Language:English Presentation type:Oral presentation (general)
Venue:Okinawa Country:Japan
-
Improvement of Implant Communication Using Joint Spatial Transmit Diversity and Signal Pre-Emphasis International conference
L. Liu, J. Wang
APEMC 2024, Okinawa, Japan 2024.05 IEICE & IEEE
Event date: 2024.05
Language:English Presentation type:Oral presentation (general)
Venue:Okinawa Country:Japan
-
Measurement Method for Mixed-Mode S-Parameters of Termination Structures in Differential Communication Line International conference
M. Yoshida, Y. Yano, and J. Wang
APEMC 2024, Okinawa, Japan 2024.05 IEICE & IEEE
Event date: 2024.05
Language:English Presentation type:Oral presentation (general)
Venue:Okinawa Country:Japan
-
Powered ESD試験における車載EthernetトランシーバICへの干渉電圧の回路シミュレーションによる検討
中谷透也、矢野佑典、王 建青
電子情報通信学会技術研究報告 2024.03 電子情報通信学会
Event date: 2024.03
Language:Japanese Presentation type:Oral presentation (general)
Venue:松江 Country:Japan
-
Bandwidth Expansion and Communication Performance Improvement of In-Body HF-UWB Small Antenna by Pre-Emphasis
K. Miyazaki, L. Liu, and J. Wang
IEICE EMCJ Technical Meeting 2023.10 IEICE
Event date: 2023.10
Language:Japanese Presentation type:Oral presentation (general)
Venue:Yonezawa Country:Japan
-
Study of Battery-less of BLE Module by Piezoelectric Element Mounted on Shoe Sole
S. Dan, Y. Yano, and J. Wang
IEICE EMCJ Technical Meeting 2023.10 IEICE
Event date: 2023.10
Language:Japanese Presentation type:Oral presentation (general)
Venue:Yonezawa Country:Japan
-
SAR evaluation for bandwidth-enhanced implant communication system with pre-emphasis technique International coauthorship International conference
L. Liu, H. Takagi, J. Shi and J. Wang
URSI GASS 2023 2023.08 URSI
Event date: 2023.08
Language:English Presentation type:Oral presentation (general)
Venue:Sapporo Country:Japan
-
Improvement of TLP-HMM’s load dependence International conference
M. Yoshida, Y. Yano, T. Ishida, and J. Wang
2023 IEEE Int. Symp. on EMC, Signal & Power Integrity 2023.08 IEEE
Event date: 2023.07 - 2023.08
Language:English Presentation type:Poster presentation
Venue:Grand Rapids Country:United States
-
Wall shaking amplitude effects on vibrating intrinsic reverberation chamber characteristics International coauthorship International conference
M. Hara, J. Wang, and F. Leferink
2023 IEEE Int. Symp. on EMC, Signal & Power Integrity 2023.08 IEEE
Event date: 2023.07 - 2023.08
Language:English Presentation type:Oral presentation (general)
Venue:Grand Rapids Country:United States
-
Investigation of reducing test system dependence for automotive Ethernet EMC evaluation International conference
Y. Yano, H. Iwasaki, and J. Wang
2023 IEEE Int. Symp. on EMC, Signal & Power Integrity 2023.08 IEEE
Event date: 2023.07 - 2023.08
Language:English Presentation type:Oral presentation (general)
Venue:Grand Rapids Country:United States
-
Quantification for setting the electric field Strength to achieve an exposure level of 6 W/kg in a reverberation chamber International conference
Jianqing Wang
45th Annual Int. Conf. of IEEE Eng. in Med. & Biol. Society (IEEE EMBC 2023) 2023.07 IEEE
Event date: 2023.07
Language:English Presentation type:Poster presentation
Venue:Sydney Country:Australia
-
Performance evaluation of 10-60 MHz implant communication at 20 Mb/s using signal pre-emphasis technique International conference
L. Liu, H. Takagi, K. Miyazaki, and J. Wang
45th Annual Int. Conf. of IEEE Eng. in Med. & Biol. Society (IEEE EMBC 2023) 2023.07 IEEE
Event date: 2023.07
Language:English Presentation type:Poster presentation
Venue:Syndey Country:Australia
-
Wearable device EMC Invited International conference
Jianqing Wang
2023 IEEE Int. Conf. on Electronic Information and Comm. Tech. (ICEICT) 2023.07 IEEE
Event date: 2023.07
Language:English Presentation type:Oral presentation (keynote)
Venue:Qingdao Country:China
-
Study of ESD Discharge Current Test Board for ESD Suppression Devices for Automotive Ethernet
S. Ishihara, Y. Yano, and J. Wang
IEICE EMCJ Technical Meeting 2023.06 IEICE
Event date: 2023.06
Language:Japanese Presentation type:Oral presentation (general)
Venue:Sapporo Country:Japan