KAMIYA Shoji

写真a

Affiliation Department etc.

Department of Electrical and Mechanical Engineering
Department of Electrical and Mechanical Engineering

Title

Professor

Graduating School

  •  
    -
    1984.03

    Tohoku University   Faculty of Engineering  

Graduate School

  •  
    -
    1989.03

    Tohoku University  Graduate School, Division of Engineering  Doctor's Course 

External Career

  • 1998.04
    -
    Now

      Associate Professor  

  • 1997.04
    -
    1998.03

      Lecturer  

  • 1991.04
    -
    1997.03

      Lecturer  

  • 1988.04
    -
    1991.03

      Research Assistant  

Field of expertise (Grants-in-aid for Scientific Research classification)

  • Materials/Mechanics of materials

 

Research Career

  • Strength evaluation of thin films on the basis of fracture mechanics

    Individual   (not selected)  

    Project Year:   - 

  • Study on the Fracture Process of Fiber-Reinforced Composite Materials

    Individual   (not selected)  

    Project Year:   - 

Papers

  • A multidimensional scheme of characterization for performance deterioration behavior of flexible devices under bending deformation

    Shoji Kamiya, Hayato Izumi, Tomohito Sekine, Nobuyuki Shishido, Hiroko Sugiyama, Yasuko Haga, Takeo Minari, Masaaki Koganemaru, Shizuo Tokito

    Thin Solid Films     2019  [Refereed]

    Research paper (scientific journal)   Multiple Authorship

  • High-Strength Sub-Micrometer Spherical Particles Fabricated by Pulsed Laser Melting in Liquid

    Mitsuhiko Kondo, NobuyukiShishido, Shoji Kamiya, Atsushi Kubo, Yoshitaka Umeno, Yoshie Ishikawa, Naoto Koshizaki

    Particle and Particle Systems Characterization   35 ( 7 ) 1800061   2018.07  [Refereed]

    Research paper (scientific journal)   Multiple Authorship

  • Electronic imaging of subcritical defect accumulation in single crystal silicon under fatigue loading

    Shoji Kamiya, Akira Kongo, Hiroko Sugiyama, Hayato Izumi

    Sensors and Actuators A: Physical   279   705 - 711   2018  [Refereed]

    Research paper (scientific journal)   Multiple Authorship

  • World-first electronic imaging of subcritical slip glowth in single crystal silicon under fatigue lopading

    Shoji Kamiya, Akira Kongo, Hiroko Sugiyama, Hayato Izumi

    The 19th international conference on solid-state sensors, actuators, and microsystems     1229 - 1232   2017.06

    Research paper (international conference proceedings)   Multiple Authorship

  • Shear stress enhanced fatigue damage accumulation in single crystalline silicon under cyclic mechanical loading

    Shoji Kamiya, Arasu Udhayakumar, Hayato Izumi, Kozo Koiwa

    Sensors and Actuators A: Physical     2016.04  [Refereed]

    Research paper (scientific journal)   Multiple Authorship

  • Investigation of continuous deformation behavior around initial yeild point of single crystal copper by using micro scale torsion test

    Koiwa Kozo, Nobuyuki Shishido, Chuantong Chen, Masaki Omiya, Shoji Kamiya, Hisashi Sato, Masahiro Nishida, Tkashi Suzuki, Tomoji Nakamura, Toshiaki Suzuki, Takeshi Nokuo

    Scripta Materialia ( Elsevier )  111   94 - 97   2016.01  [Refereed]

    Research paper (scientific journal)   Multiple Authorship

  • Shear stress with hydrogen, not oxygen, matters to the fatigue lifetime of silicon

    S. Kamiya, A. Udhayakumar, H. Izumi, K. Koiwa

    Proceedings of Transducers 2015, Anchorage, Alaska     2015.06

    Research paper (international conference proceedings)   Multiple Authorship

  • Evaluation of adhesion energy and its correlation to apparent strength for Cu/SiN interface in copper damascene interconnect structures

    S. Kamiya, C. Chen, N. Shishido, M. Omiya, K. Koiwa, H. Sato, M. Nishida, T. Suzuki, T. Nakamura, T. Nokuo, T. Suzuki

    Proceedings of IEEE 2015 International Interconnect Tehcnology Conference/Materials for Advanced Metallization Conference     2015.05

    Research paper (international conference proceedings)   Multiple Authorship

  • Scenario for catastrophic failure in interconnect structures under chip packaging interaction

    Masaki Omiya, Shoji Kamiya, Nobuyuki Shishido, Kozo Koiwa, Hisashi Sato, Masahiro Nishida

    Proceedings of IEEE International Reliability Physics Symposium     5C.3.1 - 5C.3.5   2015.04  [Refereed]

    Research paper (international conference proceedings)   Multiple Authorship

  • Hydrogen enhanced on mechanical fatigue in single crystal silicon

    Hayato Izumi, Arasu Udhayakumar, Shoji Kamiya

    Materials Letters   142   130 - 132   2014.11  [Refereed]

    Research paper (scientific journal)   Multiple Authorship

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Presentations

  • Crystal orientation effect on local adhesion strength of the interface between a damascene copper line and the insulation layer

    Nobuyuki Shishido, Yuka Oura, Hisashi Sato, Shoji Kamiya, Kozo Koiwa, Masaki Omiya, Masahiro Nishida, Takashi Suzuki, Tomoji Nakamura, Takeshi Nokuo, Toshiaki Suzuki

    Materials for Advanced Metallization  2013.03  -  2013.03 

  • Evaluation for interface strength fluctuations induced by inhomogeneous grain structure of Cu line in LSI Interconnects

    Chuantong Chen, Nobuyuki Shishido, Shoji Kamiya, Kozo Koiwa, Hisashi Sato, Masaki Omiya, Masahiro Nishida, Takashi Suzuki, Tomoji Nakamura, Takeshi Nokuo, Toshiaki Suzuki

    Materials for Advanced Metallization 2013  2013.03  -  2013.03 

  • Development of interfacial crack extension simulation between coper and insulation layer with multi-grain structure

    Kozo Koiwa, Masaki Omiya, Nobuyuki Shishido, Shoji Kamiya, Hisashi Sato, Masahiro Nishida, Takashi Suzuki, Tomoji Nakamura, Toshiaki Suzuki, Takeshi Nokuo

    Mateirals for Advanced Metallization 2013  2013.03  -  2013.03 

  • Nano-Scale Mechanical Engineering for the Reliability of Thin Film Structures in Advanced Micro Electronic Devices

    Shoji Kamiya

    Annual Conference of Taiwan Association for Coating and Thin Film Technology  2012.11  -  2012.11 

  • Mechanical Reliability of Microsystems

    Shoji Kamiya

    Invited lecture in National Chung Hsing University  2012.11  -  2012.11 

  • Local Deformation and Interfacial Fracture Behavior of Cu/Dielectric Systems in Interconnect Structures

    Hisashi Sato, Nobuyuki Shishido, Shoji Kamiya, Kozo Koiwa, Masaki Omiya, Masahiro Nishida, Takashi Suzuki, Tomoji Nakamura, Takeshi Nokuo, Tadahiro Nagasawa

    Advanced Metallization Conference 2012  2012.10  -  2012.10 

  • Development of Cu/Insulation layer interface crack extension simulation with single crystal plasticity

    Kozo Koiwa, Masaki Omiya, Nobuyuki Shishido, Shoji Kamiya, Hisashi Sato, Masahiro Nishida, Takashi Suzuki, Tomoji Nakamura, Toshiaki Suzuki, Taikeshi Nokuo

    2012 International Conference on Solid State Devices and Materials  2012.09  -  2013.09 

  • 単結晶シリコン薄膜の破壊挙動に及ぼす水と温度の影響の評価

    Islam Wd. Wahedul, 泉隼人、小川将史、神谷庄司

    日本機械学会2012年度年次大会  2012.09  -  2012.09 

  • Nano-scale Fracture Test for Local Interface Adhesion Strength Evaluation in LSI Interconnects

    N. Shishido, H. Sugiyama, S. Kamiya, H. Sato, K. Koiwa, M. Nishida, M. Omiya, T. Nagasawa, T. Nokuo, T. Suzuki, T. Nakamura

    Microscopy and Microanalysis 2012 Meeting  2012.07  -  2012.08 

  • Impact of Grain Boundaries on Adhesion Strength of Cu Interconnect Structures

    Shoji Kamiya, Nobuyuki Shishido, Shinsuke Watanabe, Hissashi Sato, Koiwa Kozo, Masaki Omiya, Masahiro Nishida, Takashi Suzuki, Tomoji Nakamura, Takeshi Nokuo, Toshiaki Suzuki

    12th International Workshop on Stress-Induced Phenomena in Microelectronics  2012.05  -  2012.05 

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